TVIS technology to be presented at the Annual Meeting of the ISL-FD MidWest Chapter

Geoff Smith will give one of the talks at the meeting to be held on Thursday April 12th at the Midwest Conference Centre, Northlake, IL, USA.

In his talk entitled “TVIS: Through Vial Impedance Spectroscopy” he will outline how the TVIS process analytical technology can be used to determine critical process parameters such as single vial product temperatures and drying rates, from which heat transfer coefficients and dry layer resistances may be obtained.